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Conference contributions
Self-assembled monolayers as Cu diffusion barriers for advanced interconections: molecular engineering
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Self-assembled monolayers as Cu diffusion barriers for advanced interconections: molecular engineering
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Date
2008
Meeting abstract
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Maestre Caro, Arantxa
;
Maes, Guido
;
Borghs, Gustaaf
;
Whelan, Caroline
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Acq. date: 2026-01-06
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Views
1882
since deposited on 2021-10-17
2
last month
1
last week
Acq. date: 2026-01-06
Citations