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Hybrid fixed abrasive CMP for 65 nm STI integration, FinFet structures and other advanced applications

dc.contributor.authorOng, Patrick
dc.contributor.authorDevriendt, Katia
dc.contributor.authorRedolfi, Augusto
dc.date.accessioned2021-10-17T09:30:17Z
dc.date.available2021-10-17T09:30:17Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14253
dc.sourceIIOimport
dc.titleHybrid fixed abrasive CMP for 65 nm STI integration, FinFet structures and other advanced applications
dc.typeProceedings paper
dc.contributor.imecauthorOng, Patrick
dc.contributor.imecauthorDevriendt, Katia
dc.contributor.imecauthorRedolfi, Augusto
dc.contributor.orcidimecOng, Patrick::0000-0002-2072-292X
dc.contributor.orcidimecDevriendt, Katia::0000-0002-0662-7926
dc.source.peerreviewyes
dc.source.conferenceInternational Conference on Planarization/CMP Technology - ICPT
dc.source.conferencedate10/11/2008
dc.source.conferencelocationHsinchu Taiwan
imec.availabilityPublished - imec


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