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The impact of ash on TDDB of metal-hard-mask-etched Cu/low-k interconnects

dc.contributor.authorPantouvaki, Marianna
dc.contributor.authorStruyf, Herbert
dc.contributor.authorHendrickx, Dirk
dc.contributor.authorHeylen, Nancy
dc.contributor.authorRichard, Olivier
dc.contributor.authorBeyer, Gerald
dc.date.accessioned2021-10-17T09:36:03Z
dc.date.available2021-10-17T09:36:03Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14269
dc.sourceIIOimport
dc.titleThe impact of ash on TDDB of metal-hard-mask-etched Cu/low-k interconnects
dc.typeMeeting abstract
dc.contributor.imecauthorPantouvaki, Marianna
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorHendrickx, Dirk
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorRichard, Olivier
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.orcidimecRichard, Olivier::0000-0002-3994-8021
dc.source.peerreviewyes
dc.source.conferenceAdvanced Metallization Conference - AMC
dc.source.conferencedate23/09/2008
dc.source.conferencelocationSan Diego, CA USA
imec.availabilityPublished - imec


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