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Thin-film MCM-D technology with through-substrate vias for the integration of 3D SiP modules

dc.contributor.authorPosada Quijano, Guillermo
dc.contributor.authorCarchon, Geert
dc.contributor.authorNauwelaers, Bart
dc.contributor.authorDe Raedt, Walter
dc.date.accessioned2021-10-17T09:58:16Z
dc.date.available2021-10-17T09:58:16Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14337
dc.sourceIIOimport
dc.titleThin-film MCM-D technology with through-substrate vias for the integration of 3D SiP modules
dc.typeProceedings paper
dc.contributor.imecauthorNauwelaers, Bart
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage2060
dc.source.endpage2066
dc.source.conference58th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate27/05/2007
dc.source.conferencelocationLake Buena Vista, FL USA
imec.availabilityPublished - open access


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