dc.contributor.author | Posada Quijano, Guillermo | |
dc.contributor.author | Carchon, Geert | |
dc.contributor.author | Nauwelaers, Bart | |
dc.contributor.author | De Raedt, Walter | |
dc.date.accessioned | 2021-10-17T09:58:16Z | |
dc.date.available | 2021-10-17T09:58:16Z | |
dc.date.issued | 2008 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/14337 | |
dc.source | IIOimport | |
dc.title | Thin-film MCM-D technology with through-substrate vias for the integration of 3D SiP modules | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Nauwelaers, Bart | |
dc.contributor.imecauthor | De Raedt, Walter | |
dc.contributor.orcidimec | De Raedt, Walter::0000-0002-7117-7976 | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 2060 | |
dc.source.endpage | 2066 | |
dc.source.conference | 58th Electronic Components and Technology Conference - ECTC | |
dc.source.conferencedate | 27/05/2007 | |
dc.source.conferencelocation | Lake Buena Vista, FL USA | |
imec.availability | Published - open access | |