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Growth and integration of high-density CNT for BEOL interconnects

dc.contributor.authorRomo Negreira, Ainhoa
dc.contributor.authorCott, Daire
dc.contributor.authorVerhulst, Anne
dc.contributor.authorCruz Esconjaurequi, Santiago
dc.contributor.authorChiodarelli, Nicolo
dc.contributor.authorEk Weis, Johan
dc.contributor.authorWhelan, Caroline
dc.contributor.authorGroeseneken, Guido
dc.contributor.authorHeyns, Marc
dc.contributor.authorDe Gendt, Stefan
dc.contributor.authorVereecken, Philippe
dc.date.accessioned2021-10-17T10:16:03Z
dc.date.available2021-10-17T10:16:03Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14389
dc.sourceIIOimport
dc.titleGrowth and integration of high-density CNT for BEOL interconnects
dc.typeProceedings paper
dc.contributor.imecauthorRomo Negreira, Ainhoa
dc.contributor.imecauthorCott, Daire
dc.contributor.imecauthorVerhulst, Anne
dc.contributor.imecauthorGroeseneken, Guido
dc.contributor.imecauthorHeyns, Marc
dc.contributor.imecauthorDe Gendt, Stefan
dc.contributor.imecauthorVereecken, Philippe
dc.contributor.orcidimecVerhulst, Anne::0000-0002-3742-9017
dc.contributor.orcidimecDe Gendt, Stefan::0000-0003-3775-3578
dc.contributor.orcidimecVereecken, Philippe::0000-0003-4115-0075
dc.source.peerreviewno
dc.source.beginpage1079-N06-01
dc.source.conferenceMaterials and Processes for Advanced Interconnects for Microelectronics
dc.source.conferencedate24/03/2008
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - imec
imec.internalnotesMRS Symposium Proceedings; Vol. 1079E


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