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Lithography options for the 32nm half pitch node and beyond

dc.contributor.authorRonse, Kurt
dc.contributor.authorJansen, Philippe
dc.contributor.authorGronheid, Roel
dc.contributor.authorHendrickx, Eric
dc.contributor.authorMaenhoudt, Mireille
dc.contributor.authorGoethals, Mieke
dc.contributor.authorVandenberghe, Geert
dc.date.accessioned2021-10-17T10:16:25Z
dc.date.available2021-10-17T10:16:25Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14390
dc.sourceIIOimport
dc.titleLithography options for the 32nm half pitch node and beyond
dc.typeProceedings paper
dc.contributor.imecauthorRonse, Kurt
dc.contributor.imecauthorGronheid, Roel
dc.contributor.imecauthorHendrickx, Eric
dc.contributor.imecauthorVandenberghe, Geert
dc.contributor.orcidimecRonse, Kurt::0000-0003-0803-4267
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage371
dc.source.endpage378
dc.source.conferenceIEEE Custom Integrated Circuits Conference - CICC
dc.source.conferencedate21/09/2008
dc.source.conferencelocationSan Jose, CA USA
imec.availabilityPublished - open access


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