A new scaled through Si via with polymer fill for 3D wafer level packaging

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Authors
Sabuncuoglu Tezcan, Deniz; Duval, Fabrice; Luhn, Ole; Soussan, Philippe; Swinnen, Bart
Conference
International Conference on Solid State Devices and Materials - SSDM
Title
A new scaled through Si via with polymer fill for 3D wafer level packaging
Publication type
Proceedings paper
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