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A new scaled through Si via with polymer fill for 3D wafer level packaging

dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.contributor.authorDuval, Fabrice
dc.contributor.authorLuhn, Ole
dc.contributor.authorSoussan, Philippe
dc.contributor.authorSwinnen, Bart
dc.date.accessioned2021-10-17T10:22:53Z
dc.date.available2021-10-17T10:22:53Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14409
dc.sourceIIOimport
dc.titleA new scaled through Si via with polymer fill for 3D wafer level packaging
dc.typeProceedings paper
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.imecauthorDuval, Fabrice
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.source.peerreviewyes
dc.source.beginpage52
dc.source.endpage53
dc.source.conferenceInternational Conference on Solid State Devices and Materials - SSDM
dc.source.conferencedate23/09/2008
dc.source.conferencelocationIbaraki Japan
imec.availabilityPublished - imec


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