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Material aspects and challenges for SOI FinFET integration

dc.contributor.authorVan Dal, Mark
dc.contributor.authorVellianitis, Georgios
dc.contributor.authorDuffy, Ray
dc.contributor.authorDoornbos, Gerben
dc.contributor.authorPawlak, Bartek
dc.contributor.authorDuriez, Blandine
dc.contributor.authorLai, Li-Shyue
dc.contributor.authorHikavyy, Andriy
dc.contributor.authorVandeweyer, Tom
dc.contributor.authorDemand, Marc
dc.contributor.authorAltamirano Sanchez, Efrain
dc.contributor.authorRooyackers, Rita
dc.contributor.authorWitters, Liesbeth
dc.contributor.authorCollaert, Nadine
dc.contributor.authorJurczak, Gosia
dc.contributor.authorKaiser, M.
dc.contributor.authorWeemaes, R. G. R.
dc.contributor.authorLander, Rob
dc.date.accessioned2021-10-17T11:39:58Z
dc.date.available2021-10-17T11:39:58Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14620
dc.sourceIIOimport
dc.titleMaterial aspects and challenges for SOI FinFET integration
dc.typeProceedings paper
dc.contributor.imecauthorVan Dal, Mark
dc.contributor.imecauthorVellianitis, Georgios
dc.contributor.imecauthorDoornbos, Gerben
dc.contributor.imecauthorPawlak, Bartek
dc.contributor.imecauthorDuriez, Blandine
dc.contributor.imecauthorHikavyy, Andriy
dc.contributor.imecauthorVandeweyer, Tom
dc.contributor.imecauthorDemand, Marc
dc.contributor.imecauthorAltamirano Sanchez, Efrain
dc.contributor.imecauthorWitters, Liesbeth
dc.contributor.imecauthorCollaert, Nadine
dc.contributor.imecauthorJurczak, Gosia
dc.contributor.orcidimecHikavyy, Andriy::0000-0002-8201-075X
dc.contributor.orcidimecCollaert, Nadine::0000-0002-8062-3165
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage223
dc.source.endpage234
dc.source.conferenceAdvanced Gate Stack, Source/Drain, and Channel Engineering for Si-based CMOS 4: New Materials, Processes, and Equipment
dc.source.conferencedate18/05/2008
dc.source.conferencelocationPhoenix, AZ USA
imec.availabilityPublished - open access
imec.internalnotesECS Transactions; Vol. 13, 1


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