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Sandwich stacks replacing SiO2 in standard bonded Si-on-insulator (SOI) substrates to obtain a high-thermal conductivity HTC-SOI substrate

dc.contributor.authorVan Wichelen, Koen
dc.contributor.authorSchaekers, Marc
dc.contributor.authorDecoutere, Stefaan
dc.contributor.authorSeacrist, Mike
dc.contributor.authorDrobny, Vladimir
dc.contributor.authorWise, Rick
dc.date.accessioned2021-10-17T12:07:07Z
dc.date.available2021-10-17T12:07:07Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14690
dc.sourceIIOimport
dc.titleSandwich stacks replacing SiO2 in standard bonded Si-on-insulator (SOI) substrates to obtain a high-thermal conductivity HTC-SOI substrate
dc.typeProceedings paper
dc.contributor.imecauthorSchaekers, Marc
dc.contributor.imecauthorDecoutere, Stefaan
dc.contributor.orcidimecSchaekers, Marc::0000-0002-1496-7816
dc.contributor.orcidimecDecoutere, Stefaan::0000-0001-6632-6239
dc.source.peerreviewno
dc.source.beginpage67
dc.source.endpage68
dc.source.conferenceIEEE International SOI Conference Proceedings
dc.source.conferencedate6/10/2008
dc.source.conferencelocationNew Paltz, NY USA
imec.availabilityPublished - imec


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