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Thermo-mechanics of 3D-wafer level and 3D stacked IC packaging technologies

dc.contributor.authorVandevelde, Bart
dc.contributor.authorOkoro, Chukwudi
dc.contributor.authorGonzalez, Mario
dc.contributor.authorSwinnen, Bart
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-17T12:15:25Z
dc.date.available2021-10-17T12:15:25Z
dc.date.issued2008-04
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14711
dc.sourceIIOimport
dc.titleThermo-mechanics of 3D-wafer level and 3D stacked IC packaging technologies
dc.typeProceedings paper
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conferenceEuroSimE: Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems
dc.source.conferencedate20/04/2008
dc.source.conferencelocationFreiburg Germany
dc.identifier.urlwww.ieee.org
imec.availabilityPublished - imec
imec.internalnotesKeynote presentation


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