Publication:
Thermo-mechanics of 3D-wafer level and 3D stacked IC packaging technologies
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1853 since deposited on 2021-10-17
3last month
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Acq. date: 2025-12-18
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Views
1853 since deposited on 2021-10-17
3last month
1last week
Acq. date: 2025-12-18
Citations