Authors

Vandevelde, Bart; Okoro, Chukwudi; Gonzalez, Mario; Swinnen, Bart; Beyne, Eric

Conference

EuroSimE: Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems

Title

Thermo-mechanics of 3D-wafer level and 3D stacked IC packaging technologies

Publication type

Proceedings paper