Publication:
Thermo-mechanics of 3D-wafer level and 3D stacked IC packaging technologies
Date
| dc.contributor.author | Vandevelde, Bart | |
| dc.contributor.author | Okoro, Chukwudi | |
| dc.contributor.author | Gonzalez, Mario | |
| dc.contributor.author | Swinnen, Bart | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Vandevelde, Bart | |
| dc.contributor.imecauthor | Gonzalez, Mario | |
| dc.contributor.imecauthor | Swinnen, Bart | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-17T12:15:25Z | |
| dc.date.available | 2021-10-17T12:15:25Z | |
| dc.date.issued | 2008-04 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/14711 | |
| dc.identifier.url | www.ieee.org | |
| dc.source.conference | EuroSimE: Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems | |
| dc.source.conferencedate | 20/04/2008 | |
| dc.source.conferencelocation | Freiburg Germany | |
| dc.title | Thermo-mechanics of 3D-wafer level and 3D stacked IC packaging technologies | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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