Publication:
Thermo-mechanics of 3D-wafer level and 3D stacked IC packaging technologies
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1856 since deposited on 2021-10-17
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Acq. date: 2026-04-06
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Statistics
Views
1856 since deposited on 2021-10-17
2last month
2last week
Acq. date: 2026-04-06
Citations