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Flip chip based packaging solution for high current driver chips used in automotive applications
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Authors
Vandevelde, Bart
;
Vandecasteele, Bjorn
;
Vanderstraeten, Daniel
;
Brizar, Guy
;
Blansaer, Eddy
Conference
2nd Electronics Systemintegration Technology Conference - ESTC
Title
Flip chip based packaging solution for high current driver chips used in automotive applications
Publication type
Proceedings paper
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