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Flip chip based packaging solution for high current driver chips used in automotive applications

dc.contributor.authorVandevelde, Bart
dc.contributor.authorVandecasteele, Bjorn
dc.contributor.authorVanderstraeten, Daniel
dc.contributor.authorBrizar, Guy
dc.contributor.authorBlansaer, Eddy
dc.date.accessioned2021-10-17T12:15:48Z
dc.date.available2021-10-17T12:15:48Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14712
dc.sourceIIOimport
dc.titleFlip chip based packaging solution for high current driver chips used in automotive applications
dc.typeProceedings paper
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorVandecasteele, Bjorn
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.source.peerreviewno
dc.source.beginpage583
dc.source.endpage588
dc.source.conference2nd Electronics Systemintegration Technology Conference - ESTC
dc.source.conferencedate1/09/2008
dc.source.conferencelocationGreenwich UK
imec.availabilityPublished - imec


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