dc.contributor.author | Vanfleteren, Jan | |
dc.contributor.author | Axisa, Fabrice | |
dc.contributor.author | Brosteaux, Dominique | |
dc.contributor.author | Bossuyt, Frederick | |
dc.contributor.author | De Leersnyder, Eva | |
dc.contributor.author | Vervust, Thomas | |
dc.contributor.author | Huyghe, Benoit | |
dc.contributor.author | Missinne, Jeroen | |
dc.contributor.author | Verplancke, Rik | |
dc.contributor.author | Gonzalez, Mario | |
dc.date.accessioned | 2021-10-17T12:18:42Z | |
dc.date.available | 2021-10-17T12:18:42Z | |
dc.date.issued | 2008 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/14719 | |
dc.source | IIOimport | |
dc.title | Elastic electronic circuits and systems using moulded interconnect device (MID) technology | |
dc.type | Meeting abstract | |
dc.contributor.imecauthor | Vanfleteren, Jan | |
dc.contributor.imecauthor | Bossuyt, Frederick | |
dc.contributor.imecauthor | Vervust, Thomas | |
dc.contributor.imecauthor | Missinne, Jeroen | |
dc.contributor.imecauthor | Verplancke, Rik | |
dc.contributor.imecauthor | Gonzalez, Mario | |
dc.contributor.orcidimec | Vanfleteren, Jan::0000-0002-9654-7304 | |
dc.contributor.orcidimec | Bossuyt, Frederick::0000-0003-3350-9295 | |
dc.contributor.orcidimec | Missinne, Jeroen::0000-0002-3470-620X | |
dc.contributor.orcidimec | Verplancke, Rik::0000-0002-6642-9454 | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | no | |
dc.source.conference | Materials and Technology for Flexible, Conformable, and Strechtchable Sensors and Transistors | |
dc.source.conferencedate | 25/03/2008 | |
dc.source.conferencelocation | San Francisco, CA USA | |
imec.availability | Published - open access | |