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dc.contributor.authorVanfleteren, Jan
dc.contributor.authorAxisa, Fabrice
dc.contributor.authorBrosteaux, Dominique
dc.contributor.authorBossuyt, Frederick
dc.contributor.authorDe Leersnyder, Eva
dc.contributor.authorVervust, Thomas
dc.contributor.authorHuyghe, Benoit
dc.contributor.authorMissinne, Jeroen
dc.contributor.authorVerplancke, Rik
dc.contributor.authorGonzalez, Mario
dc.date.accessioned2021-10-17T12:18:42Z
dc.date.available2021-10-17T12:18:42Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14719
dc.sourceIIOimport
dc.titleElastic electronic circuits and systems using moulded interconnect device (MID) technology
dc.typeMeeting abstract
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.imecauthorBossuyt, Frederick
dc.contributor.imecauthorVervust, Thomas
dc.contributor.imecauthorMissinne, Jeroen
dc.contributor.imecauthorVerplancke, Rik
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.contributor.orcidimecBossuyt, Frederick::0000-0003-3350-9295
dc.contributor.orcidimecMissinne, Jeroen::0000-0002-3470-620X
dc.contributor.orcidimecVerplancke, Rik::0000-0002-6642-9454
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.conferenceMaterials and Technology for Flexible, Conformable, and Strechtchable Sensors and Transistors
dc.source.conferencedate25/03/2008
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - open access


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