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Growth and integration of high-density CNT for advanced interconnects

dc.contributor.authorVereecken, Philippe
dc.contributor.authorCott, Daire
dc.contributor.authorChiodarelli, Nicolo
dc.contributor.authorRomo Negreira, Ainhoa
dc.contributor.authorVerhulst, Anne
dc.contributor.authorHantschel, Thomas
dc.contributor.authorRichard, Olivier
dc.contributor.authorGroeseneken, Guido
dc.contributor.authorHeyns, Marc
dc.contributor.authorDe Gendt, Stefan
dc.date.accessioned2021-10-17T12:28:59Z
dc.date.available2021-10-17T12:28:59Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14742
dc.sourceIIOimport
dc.titleGrowth and integration of high-density CNT for advanced interconnects
dc.typeMeeting abstract
dc.contributor.imecauthorVereecken, Philippe
dc.contributor.imecauthorCott, Daire
dc.contributor.imecauthorRomo Negreira, Ainhoa
dc.contributor.imecauthorVerhulst, Anne
dc.contributor.imecauthorHantschel, Thomas
dc.contributor.imecauthorRichard, Olivier
dc.contributor.imecauthorGroeseneken, Guido
dc.contributor.imecauthorHeyns, Marc
dc.contributor.imecauthorDe Gendt, Stefan
dc.contributor.orcidimecVereecken, Philippe::0000-0003-4115-0075
dc.contributor.orcidimecVerhulst, Anne::0000-0002-3742-9017
dc.contributor.orcidimecHantschel, Thomas::0000-0001-9476-4084
dc.contributor.orcidimecRichard, Olivier::0000-0002-3994-8021
dc.contributor.orcidimecDe Gendt, Stefan::0000-0003-3775-3578
dc.source.peerreviewno
dc.source.beginpage182
dc.source.endpage183
dc.source.conference14th International Conference on Solid Films and Surfaces - ICSFS
dc.source.conferencedate29/06/2008
dc.source.conferencelocationDublin Ireland
dc.identifier.urlwww.icsfs.ie
imec.availabilityPublished - imec


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