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The removal of silica particles from micron wide trenches by megasonic cleaning

dc.contributor.authorWostyn, Kurt
dc.contributor.authorQuenette, V.
dc.contributor.authorVereecke, Guy
dc.contributor.authorMertens, Paul
dc.date.accessioned2021-10-17T12:51:13Z
dc.date.available2021-10-17T12:51:13Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14796
dc.sourceIIOimport
dc.titleThe removal of silica particles from micron wide trenches by megasonic cleaning
dc.typeProceedings paper
dc.contributor.imecauthorWostyn, Kurt
dc.contributor.imecauthorVereecke, Guy
dc.contributor.imecauthorMertens, Paul
dc.contributor.orcidimecWostyn, Kurt::0000-0003-3995-0292
dc.contributor.orcidimecVereecke, Guy::0000-0001-9058-9338
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage221
dc.source.endpage224
dc.source.conferenceUltra Clean Processing of Semiconductor Surfaces VIII - UCPSS
dc.source.conferencedate18/09/2006
dc.source.conferencelocationAntwerpen Belgium
imec.availabilityPublished - open access
imec.internalnotesSolid State Phenomena; Vol. 134


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