Study of Au/In reaction for transient liquid phase bonding and 3D chip stacking

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Authors

Zhang, Wenqi; Ruythooren, Wouter

ISSN

0361-5235

Issue

8

Journal

Journal of Electronic Materials

Volume

37

Title

Study of Au/In reaction for transient liquid phase bonding and 3D chip stacking

Publication type

Journal article

Embargo date

9999-12-31

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