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Post-dicing particle control for 3D stacked IC integration flows

dc.contributor.authorBearda, Twan
dc.contributor.authorTravaly, Youssef
dc.contributor.authorWostyn, Kurt
dc.contributor.authorHalder, Sandip
dc.contributor.authorSwinnen, Bart
dc.contributor.authorMülders, Thomas
dc.contributor.authorVarghese, Ivan
dc.contributor.authorCheng, Paul
dc.date.accessioned2021-10-17T21:20:50Z
dc.date.available2021-10-17T21:20:50Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14958
dc.sourceIIOimport
dc.titlePost-dicing particle control for 3D stacked IC integration flows
dc.typeProceedings paper
dc.contributor.imecauthorWostyn, Kurt
dc.contributor.imecauthorHalder, Sandip
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.orcidimecWostyn, Kurt::0000-0003-3995-0292
dc.contributor.orcidimecHalder, Sandip::0000-0002-6314-2685
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage1513
dc.source.endpage1516
dc.source.conference59th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate25/05/2009
dc.source.conferencelocationSan Diego, CA USA
imec.availabilityPublished - open access


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