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Application of substrate noise simulation methodology to 3D-stacking

dc.contributor.authorBronckers, Stephane
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorMarchal, Pol
dc.contributor.authorRolain, Yves
dc.date.accessioned2021-10-17T21:28:38Z
dc.date.available2021-10-17T21:28:38Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15045
dc.sourceIIOimport
dc.titleApplication of substrate noise simulation methodology to 3D-stacking
dc.typeOral presentation
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.source.peerreviewno
dc.source.conferenceDesign, Automation and Test in Europe Conference - DATE: Workshop on 3D Integration (W5)
dc.source.conferencedate20/04/2009
dc.source.conferencelocationNice France
imec.availabilityPublished - imec


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