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Die stacking using 3D-wafer level packaging copper/polymer through-Si via technology and Cu/Sn interconnect bumping

dc.contributor.authorCivale, Yann
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.contributor.authorPhilipsen, Harold
dc.contributor.authorJaenen, Patrick
dc.contributor.authorAgarwal, Rahul
dc.contributor.authorDuval, Fabrice
dc.contributor.authorSoussan, Philippe
dc.contributor.authorTravaly, Youssef
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-17T21:36:14Z
dc.date.available2021-10-17T21:36:14Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15102
dc.sourceIIOimport
dc.titleDie stacking using 3D-wafer level packaging copper/polymer through-Si via technology and Cu/Sn interconnect bumping
dc.typeProceedings paper
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.imecauthorPhilipsen, Harold
dc.contributor.imecauthorJaenen, Patrick
dc.contributor.imecauthorDuval, Fabrice
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.contributor.orcidimecPhilipsen, Harold::0000-0002-5029-1104
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.conferenceIEEE International Conference on 3D System Integration
dc.source.conferencedate28/09/2009
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - open access


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