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Integration of porogen-based low-k films: influence of capping layer thickness and long thermal anneals on low-k damage and reliability
Publication:
Integration of porogen-based low-k films: influence of capping layer thickness and long thermal anneals on low-k damage and reliability
Date
2009
Meeting abstract
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
De Roest, David
;
Vereecke, Bart
;
Huffman, Craig
;
Heylen, Nancy
;
Croes, Kristof
;
Arai, H
;
Takamure, N
;
Beynet, Julien
;
Sprey, Hessel
;
Matsushita, K
;
Kobayashi, N
;
Verdonck, Patrick
;
Demuynck, Steven
;
Beyer, Gerald
;
Tokei, Zsolt
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Views
1923
since deposited on 2021-10-17
437
item.page.metrics.field.last-week
Acq. date: 2025-10-24
Citations