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dc.contributor.authorDe Roest, David
dc.contributor.authorVereecke, Bart
dc.contributor.authorHuffman, Craig
dc.contributor.authorHeylen, Nancy
dc.contributor.authorCroes, Kristof
dc.contributor.authorArai, H
dc.contributor.authorTakamure, N
dc.contributor.authorBeynet, Julien
dc.contributor.authorSprey, Hessel
dc.contributor.authorMatsushita, K
dc.contributor.authorKobayashi, N
dc.contributor.authorVerdonck, Patrick
dc.contributor.authorDemuynck, Steven
dc.contributor.authorBeyer, Gerald
dc.contributor.authorTokei, Zsolt
dc.date.accessioned2021-10-17T21:48:32Z
dc.date.available2021-10-17T21:48:32Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15181
dc.sourceIIOimport
dc.titleIntegration of porogen-based low-k films: influence of capping layer thickness and long thermal anneals on low-k damage and reliability
dc.typeMeeting abstract
dc.contributor.imecauthorDe Roest, David
dc.contributor.imecauthorVereecke, Bart
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorSprey, Hessel
dc.contributor.imecauthorVerdonck, Patrick
dc.contributor.imecauthorDemuynck, Steven
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecVerdonck, Patrick::0000-0003-2454-0602
dc.source.peerreviewno
dc.source.conferenceAdvanced Metallization Conference
dc.source.conferencedate13/10/2009
dc.source.conferencelocationBaltimore, MD USA
imec.availabilityPublished - imec


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