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New methods and instrumentation for functional, yield and reliability testing of MEMS on device, chip and wafer level

dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorDe Coster, Jeroen
dc.contributor.authorCherman, Vladimir
dc.contributor.authorCzarnecki, Piotr
dc.contributor.authorKalicinski, Stanislaw
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorSangameswaran, Sandeep
dc.contributor.authorVanstreels, Kris
dc.date.accessioned2021-10-17T21:50:34Z
dc.date.available2021-10-17T21:50:34Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15193
dc.sourceIIOimport
dc.titleNew methods and instrumentation for functional, yield and reliability testing of MEMS on device, chip and wafer level
dc.typeProceedings paper
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorDe Coster, Jeroen
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorCzarnecki, Piotr
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage73620N
dc.source.conferenceSPIE Europe Microtechnologies for the New Millennium
dc.source.conferencedate4/05/2009
dc.source.conferencelocationDresden Germany
imec.availabilityPublished - open access
imec.internalnotesProceedings of SPIE; Vol. 7362


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