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A novel interconnect design with high stretchability and fine pitch capability for applications in stretchable electronics

dc.contributor.authorHsu, Yung-Yu
dc.contributor.authorGonzalez, Mario
dc.contributor.authorBossuyt, Frederick
dc.contributor.authorAxisa, Fabrice
dc.contributor.authorVanfleteren, Jan
dc.contributor.authorDe Wolf, Ingrid
dc.date.accessioned2021-10-17T22:59:20Z
dc.date.available2021-10-17T22:59:20Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15495
dc.sourceIIOimport
dc.titleA novel interconnect design with high stretchability and fine pitch capability for applications in stretchable electronics
dc.typeProceedings paper
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorBossuyt, Frederick
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecBossuyt, Frederick::0000-0003-3350-9295
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1192-PP15-03
dc.source.conferenceMaterials and Devices for Flexible and Stretchable Electronics
dc.source.conferencedate13/04/2009
dc.source.conferencelocationSan Francisco, CA USA
dc.identifier.urlwww.mrs.org
imec.availabilityPublished - open access
imec.internalnotesMRS Symposium Proceedings; Vol. 1192E


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