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A novel interconnect design with high stretchability and fine pitch capability for applications in stretchable electronics
Publication:
A novel interconnect design with high stretchability and fine pitch capability for applications in stretchable electronics
Date
2009
Proceedings Paper
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18135.pdf
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Hsu, Yung-Yu
;
Gonzalez, Mario
;
Bossuyt, Frederick
;
Axisa, Fabrice
;
Vanfleteren, Jan
;
De Wolf, Ingrid
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Abstract
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1921
since deposited on 2021-10-17
Acq. date: 2025-10-27
Citations
Metrics
Views
1921
since deposited on 2021-10-17
Acq. date: 2025-10-27
Citations