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A novel interconnect design with high stretchability and fine pitch capability for applications in stretchable electronics

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cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0003-3350-9295
cris.virtual.orcid0000-0003-4374-4854
cris.virtual.orcid0000-0002-9654-7304
cris.virtual.orcid0000-0003-3822-5953
cris.virtualsource.department9925102b-6389-40c1-afbd-fdc1aa572b36
cris.virtualsource.departmentb98b120a-aea4-4c29-835f-6fae89301f2f
cris.virtualsource.department44a3a82b-55ff-4186-b5db-5e0130b85450
cris.virtualsource.department99f46578-0b77-4a3f-b8e5-a6879cd2ea9a
cris.virtualsource.orcid9925102b-6389-40c1-afbd-fdc1aa572b36
cris.virtualsource.orcidb98b120a-aea4-4c29-835f-6fae89301f2f
cris.virtualsource.orcid44a3a82b-55ff-4186-b5db-5e0130b85450
cris.virtualsource.orcid99f46578-0b77-4a3f-b8e5-a6879cd2ea9a
dc.contributor.authorHsu, Yung-Yu
dc.contributor.authorGonzalez, Mario
dc.contributor.authorBossuyt, Frederick
dc.contributor.authorAxisa, Fabrice
dc.contributor.authorVanfleteren, Jan
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorBossuyt, Frederick
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecBossuyt, Frederick::0000-0003-3350-9295
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.accessioned2021-10-17T22:59:20Z
dc.date.available2021-10-17T22:59:20Z
dc.date.embargo9999-12-31
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15495
dc.identifier.urlwww.mrs.org
dc.source.beginpage1192-PP15-03
dc.source.conferenceMaterials and Devices for Flexible and Stretchable Electronics
dc.source.conferencedate13/04/2009
dc.source.conferencelocationSan Francisco, CA USA
dc.title

A novel interconnect design with high stretchability and fine pitch capability for applications in stretchable electronics

dc.typeProceedings paper
dspace.entity.typePublication
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