Publication:

A novel interconnect design with high stretchability and fine pitch capability for applications in stretchable electronics

Date

2009
Proceedings Paper
Simple item page Full metadata Statistics
 
dc.contributor.authorHsu, Yung-Yu
dc.contributor.authorGonzalez, Mario
dc.contributor.authorBossuyt, Frederick
dc.contributor.authorAxisa, Fabrice
dc.contributor.authorVanfleteren, Jan
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorBossuyt, Frederick
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecBossuyt, Frederick::0000-0003-3350-9295
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.accessioned2021-10-17T22:59:20Z
dc.date.available2021-10-17T22:59:20Z
dc.date.embargo9999-12-31
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15495
dc.identifier.urlwww.mrs.org
dc.source.beginpage1192-PP15-03
dc.source.conferenceMaterials and Devices for Flexible and Stretchable Electronics
dc.source.conferencedate13/04/2009
dc.source.conferencelocationSan Francisco, CA USA
dc.title

A novel interconnect design with high stretchability and fine pitch capability for applications in stretchable electronics

dc.typeProceedings paper
dspace.entity.typePublication
Files

Original bundle

Name:
18135.pdf
Size:
851.69 KB
Format:
Adobe Portable Document Format
Download
Publication available in collections:
Conference contributions