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Conference contributions
A novel interconnect design with high stretchability and fine pitch capability for applications in stretchable electronics
Publication:
A novel interconnect design with high stretchability and fine pitch capability for applications in stretchable electronics
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Date
2009
Proceedings Paper
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18135.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Hsu, Yung-Yu
;
Gonzalez, Mario
;
Bossuyt, Frederick
;
Axisa, Fabrice
;
Vanfleteren, Jan
;
De Wolf, Ingrid
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1924
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Acq. date: 2025-12-11
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Views
1924
since deposited on 2021-10-17
1
last month
Acq. date: 2025-12-11
Citations