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Plasma process optimization for dual pattern 30nm half pitch interconnect application

dc.contributor.authorHuffman, Craig
dc.contributor.authorde Marneffe, Jean-Francois
dc.contributor.authorDemuynck, Steven
dc.contributor.authorGoossens, Danny
dc.contributor.authorBeyer, Gerald
dc.contributor.authorStruyf, Herbert
dc.date.accessioned2021-10-17T23:02:29Z
dc.date.available2021-10-17T23:02:29Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15507
dc.sourceIIOimport
dc.titlePlasma process optimization for dual pattern 30nm half pitch interconnect application
dc.typeMeeting abstract
dc.contributor.imecauthorde Marneffe, Jean-Francois
dc.contributor.imecauthorDemuynck, Steven
dc.contributor.imecauthorGoossens, Danny
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorStruyf, Herbert
dc.source.peerreviewno
dc.source.conferenceMaterials for Advance Metallization Conference - MAM
dc.source.conferencedate8/03/2009
dc.source.conferencelocationGrenoble France
imec.availabilityPublished - imec


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