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3D stacked ICs using Cu TSVs and die to wafer hybrid collective bonding

dc.contributor.authorKatti, Guruprasad
dc.contributor.authorMercha, Abdelkarim
dc.contributor.authorVan Olmen, Jan
dc.contributor.authorHuyghebaert, Cedric
dc.contributor.authorJourdain, Anne
dc.contributor.authorStucchi, Michele
dc.contributor.authorRakowski, Michal
dc.contributor.authorDebusschere, Ingrid
dc.contributor.authorSoussan, Philippe
dc.contributor.authorDehaene, Wim
dc.contributor.authorDe Meyer, Kristin
dc.contributor.authorTravaly, Youssef
dc.contributor.authorBeyne, Eric
dc.contributor.authorBiesemans, Serge
dc.contributor.authorSwinnen, Bart
dc.date.accessioned2021-10-17T23:20:10Z
dc.date.available2021-10-17T23:20:10Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15572
dc.sourceIIOimport
dc.title3D stacked ICs using Cu TSVs and die to wafer hybrid collective bonding
dc.typeProceedings paper
dc.contributor.imecauthorMercha, Abdelkarim
dc.contributor.imecauthorVan Olmen, Jan
dc.contributor.imecauthorHuyghebaert, Cedric
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorRakowski, Michal
dc.contributor.imecauthorDebusschere, Ingrid
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.imecauthorDehaene, Wim
dc.contributor.imecauthorDe Meyer, Kristin
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorBiesemans, Serge
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.orcidimecMercha, Abdelkarim::0000-0002-2174-6958
dc.contributor.orcidimecHuyghebaert, Cedric::0000-0001-6043-7130
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage357
dc.source.endpage360
dc.source.conferenceIEEE International Electron Devices Meeting - IEDM
dc.source.conferencedate7/12/2009
dc.source.conferencelocationBaltimore, MD USA
imec.availabilityPublished - open access


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