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New cleaning solutions for all-wet-post etch residue removal on Cu BEOL for sub 45nm nodes

dc.contributor.authorKlipp, Andreas
dc.contributor.authorVereecke, Guy
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorClaes, Martine
dc.date.accessioned2021-10-17T23:30:57Z
dc.date.available2021-10-17T23:30:57Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15607
dc.sourceIIOimport
dc.titleNew cleaning solutions for all-wet-post etch residue removal on Cu BEOL for sub 45nm nodes
dc.typeProceedings paper
dc.contributor.imecauthorVereecke, Guy
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorClaes, Martine
dc.contributor.orcidimecVereecke, Guy::0000-0001-9058-9338
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.source.peerreviewyes
dc.source.conferenceSematech Surface Preparation and Cleaning Conference
dc.source.conferencedate23/03/2009
dc.source.conferencelocationAustin, TX USA
imec.availabilityPublished - imec


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