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The role of additives and deposition parameters in Cu plating of high aspect ratio vias

dc.contributor.authorKo, Ted
dc.contributor.authorRadisic, Alex
dc.contributor.authorArmini, Silvia
dc.contributor.authorVereecken, Philippe
dc.contributor.authorDrijbooms, Chris
dc.contributor.authorBender, Hugo
dc.contributor.authorSun, S.P.
dc.contributor.authorWann, C.
dc.contributor.authorYu, C.H.
dc.contributor.authorLeunissen, Peter
dc.contributor.authorRuythooren, Wouter
dc.contributor.authorVanhaelemeersch, Serge
dc.date.accessioned2021-10-17T23:32:06Z
dc.date.available2021-10-17T23:32:06Z
dc.date.issued2009-10
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15611
dc.sourceIIOimport
dc.titleThe role of additives and deposition parameters in Cu plating of high aspect ratio vias
dc.typeMeeting abstract
dc.contributor.imecauthorRadisic, Alex
dc.contributor.imecauthorArmini, Silvia
dc.contributor.imecauthorVereecken, Philippe
dc.contributor.imecauthorDrijbooms, Chris
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorRuythooren, Wouter
dc.contributor.imecauthorVanhaelemeersch, Serge
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.contributor.orcidimecVereecken, Philippe::0000-0003-4115-0075
dc.contributor.orcidimecVanhaelemeersch, Serge::0000-0003-2102-7395
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage2179
dc.source.conference216th ECS Meeting
dc.source.conferencedate4/10/2009
dc.source.conferencelocationVienna Austria
imec.availabilityPublished - open access
imec.internalnotesMeeting Abstracts; Vol. MA2009-02


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