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Removal of post-etch 193 nm photoresist in porous low-k dielectric patterning using UV irradiation and wet chemistries
Publication:
Removal of post-etch 193 nm photoresist in porous low-k dielectric patterning using UV irradiation and wet chemistries
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Date
2009
Proceedings Paper
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18638.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Le, Quoc Toan
;
Kesters, Els
;
Prager, Lutz
;
Lux, Marcel
;
Vereecke, Guy
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Abstract
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1902
since deposited on 2021-10-17
Acq. date: 2025-12-11
Citations
Metrics
Views
1902
since deposited on 2021-10-17
Acq. date: 2025-12-11
Citations