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Removal of post-etch 193 nm photoresist in porous low-k dielectric patterning using UV irradiation and wet chemistries

dc.contributor.authorLe, Quoc Toan
dc.contributor.authorKesters, Els
dc.contributor.authorPrager, Lutz
dc.contributor.authorLux, Marcel
dc.contributor.authorVereecke, Guy
dc.date.accessioned2021-10-17T23:51:25Z
dc.date.available2021-10-17T23:51:25Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15679
dc.sourceIIOimport
dc.titleRemoval of post-etch 193 nm photoresist in porous low-k dielectric patterning using UV irradiation and wet chemistries
dc.typeProceedings paper
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorKesters, Els
dc.contributor.imecauthorLux, Marcel
dc.contributor.imecauthorVereecke, Guy
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.contributor.orcidimecVereecke, Guy::0000-0001-9058-9338
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.conferenceSematech Surface Preparation and Cleaning Conference - SPCC
dc.source.conferencedate23/03/2009
dc.source.conferencelocationAustin, TX USA
imec.availabilityPublished - open access


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