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Removal of photoresist and BARC in Cu BEOL using an all-wet process

dc.contributor.authorLe, Quoc Toan
dc.contributor.authorKlipp, Andreas
dc.contributor.authorLux, Marcel
dc.contributor.authorLi, Yunlong
dc.contributor.authorZhao, Larry
dc.contributor.authorVereecke, Guy
dc.date.accessioned2021-10-17T23:52:00Z
dc.date.available2021-10-17T23:52:00Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15681
dc.sourceIIOimport
dc.titleRemoval of photoresist and BARC in Cu BEOL using an all-wet process
dc.typeProceedings paper
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorLux, Marcel
dc.contributor.imecauthorLi, Yunlong
dc.contributor.imecauthorVereecke, Guy
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.contributor.orcidimecLi, Yunlong::0000-0003-4791-4013
dc.contributor.orcidimecVereecke, Guy::0000-0001-9058-9338
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage173
dc.source.endpage178
dc.source.conferenceCleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing 11
dc.source.conferencedate4/10/2009
dc.source.conferencelocationVienna Austria
imec.availabilityPublished - open access
imec.internalnotesECS Transactions; Vol. 25, issue 5


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