Show simple item record

An integrated creep, crack growth and thermo-mechanical fatigue model for WLCSP assemblies soldered with SAC 405

dc.contributor.authorLimaye, Paresh
dc.contributor.authorVandevelde, Bart
dc.contributor.authorVandepitte, Dirk
dc.contributor.authorVerlinden, Bert
dc.date.accessioned2021-10-18T00:03:50Z
dc.date.available2021-10-18T00:03:50Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15721
dc.sourceIIOimport
dc.titleAn integrated creep, crack growth and thermo-mechanical fatigue model for WLCSP assemblies soldered with SAC 405
dc.typeProceedings paper
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage704
dc.source.endpage712
dc.source.conference59th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate25/05/2009
dc.source.conferencelocationSan Diego, CA USA
imec.availabilityPublished - open access


Files in this item

Thumbnail
Name:
18099.pdf
Size:
1.570Mb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record