Authors

Limaye, Paresh; Vandevelde, Bart; Vandepitte, Dirk; Verlinden, Bert

Conference

59th Electronic Components and Technology Conference - ECTC

Title

An integrated creep, crack growth and thermo-mechanical fatigue model for WLCSP assemblies soldered with SAC 405

Publication type

Proceedings paper

Embargo date

9999-12-31