Publication:

An integrated creep, crack growth and thermo-mechanical fatigue model for WLCSP assemblies soldered with SAC 405

Date

2009
Proceedings Paper
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dc.contributor.authorLimaye, Paresh
dc.contributor.authorVandevelde, Bart
dc.contributor.authorVandepitte, Dirk
dc.contributor.authorVerlinden, Bert
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.date.accessioned2021-10-18T00:03:50Z
dc.date.available2021-10-18T00:03:50Z
dc.date.embargo9999-12-31
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15721
dc.source.beginpage704
dc.source.conference59th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate25/05/2009
dc.source.conferencelocationSan Diego, CA USA
dc.source.endpage712
dc.title

An integrated creep, crack growth and thermo-mechanical fatigue model for WLCSP assemblies soldered with SAC 405

dc.typeProceedings paper
dspace.entity.typePublication
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