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Conference contributions
An integrated creep, crack growth and thermo-mechanical fatigue model for WLCSP assemblies soldered with SAC 405
Publication:
An integrated creep, crack growth and thermo-mechanical fatigue model for WLCSP assemblies soldered with SAC 405
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Date
2009
Proceedings Paper
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18099.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Limaye, Paresh
;
Vandevelde, Bart
;
Vandepitte, Dirk
;
Verlinden, Bert
Journal
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1879
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Acq. date: 2025-12-10
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Metrics
Views
1879
since deposited on 2021-10-18
1
last month
Acq. date: 2025-12-10
Citations