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Characteristics of copper electrodeposits on featureless substrates and in microvias with aspect ratio up to 10

dc.contributor.authorLuhn, Ole
dc.contributor.authorRadisic, Alex
dc.contributor.authorVereecken, Philippe
dc.contributor.authorVan Hoof, Chris
dc.contributor.authorRuythooren, Wouter
dc.contributor.authorCelis, Jean-Pierre
dc.date.accessioned2021-10-18T00:17:43Z
dc.date.available2021-10-18T00:17:43Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15766
dc.sourceIIOimport
dc.titleCharacteristics of copper electrodeposits on featureless substrates and in microvias with aspect ratio up to 10
dc.typeMeeting abstract
dc.contributor.imecauthorRadisic, Alex
dc.contributor.imecauthorVereecken, Philippe
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.imecauthorRuythooren, Wouter
dc.contributor.orcidimecVereecken, Philippe::0000-0003-4115-0075
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage997
dc.source.conference215th Electrochemical Society Spring Meeting
dc.source.conferencedate24/05/2009
dc.source.conferencelocationSan Fransisco, CA USA
imec.availabilityPublished - open access
imec.internalnotesMeeting Abstracts; Vol. MA2009-01


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