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Changing superfilling mode for copper electrodeposition in blind holes from differential inhibition to differential acceleration
Publication:
Changing superfilling mode for copper electrodeposition in blind holes from differential inhibition to differential acceleration
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Date
2009
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Luhn, Ole
;
Radisic, Alex
;
Vereecken, Philippe
;
Van Hoof, Chris
;
Ruythooren, Wouter
;
Celis, Jean-Pierre
Journal
Electrochemical and Solid-State Letters
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1962
since deposited on 2021-10-18
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Acq. date: 2026-01-07
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Metrics
Views
1962
since deposited on 2021-10-18
1
last month
1
last week
Acq. date: 2026-01-07
Citations