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On the cost-effectiveness of KGD testing for TSV-based 3D-SICs

dc.contributor.authorMarinissen, Erik Jan
dc.contributor.authorBeyne, Eric
dc.contributor.authorDupas, Luc
dc.contributor.authorVelenis, Dimitrios
dc.date.accessioned2021-10-18T00:37:08Z
dc.date.available2021-10-18T00:37:08Z
dc.date.issued2009-10
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15828
dc.sourceIIOimport
dc.titleOn the cost-effectiveness of KGD testing for TSV-based 3D-SICs
dc.typeProceedings paper
dc.contributor.imecauthorMarinissen, Erik Jan
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDupas, Luc
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.orcidimecMarinissen, Erik Jan::0000-0002-5058-8303
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage18
dc.source.conferenceSEMI Known-Good Die Packaging and Test Workshop - KGD
dc.source.conferencedate1/10/2009
dc.source.conferencelocationSanta Clara, CA USA
imec.availabilityPublished - imec
imec.internalnotesOutput on password-protected SEMI web site


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