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Photonics-CMOS 3D integration: copper through-silicon-via approach

dc.contributor.authorMasood, Adil
dc.contributor.authorBogaerts, Wim
dc.contributor.authorVan Olmen, Jan
dc.contributor.authorVan Aelst, Joke
dc.contributor.authorVan Thourhout, Dries
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.date.accessioned2021-10-18T00:41:15Z
dc.date.available2021-10-18T00:41:15Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15841
dc.sourceIIOimport
dc.titlePhotonics-CMOS 3D integration: copper through-silicon-via approach
dc.typeProceedings paper
dc.contributor.imecauthorMasood, Adil
dc.contributor.imecauthorBogaerts, Wim
dc.contributor.imecauthorVan Olmen, Jan
dc.contributor.imecauthorVan Aelst, Joke
dc.contributor.imecauthorVan Thourhout, Dries
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.orcidimecBogaerts, Wim::0000-0003-1112-8950
dc.contributor.orcidimecVan Thourhout, Dries::0000-0003-0111-431X
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage165
dc.source.endpage168
dc.source.conference14th Annual Symposium of the IEEE Photonics Benelux Chapter
dc.source.conferencedate5/11/2009
dc.source.conferencelocationBrussels Belgium
imec.availabilityPublished - open access


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