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Impact of thinning and packaging on a deep sub-micron CMOS product

dc.contributor.authorPerry, Dan
dc.contributor.authorRay, Urmi
dc.contributor.authorGu, Sam
dc.contributor.authorNakamoto, Mark
dc.contributor.authorSy, Wing
dc.contributor.authorWang, Kevin
dc.contributor.authorRuythooren, Wouter
dc.contributor.authorYang, Yu
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorCotrin Teixeira, Ricardo
dc.contributor.authorGonzalez, Mario
dc.contributor.authorSimons, Veerle
dc.contributor.authorBerry, Christopher J.
dc.contributor.authorLee, KiWook
dc.contributor.authorBurggraf, Jürgen
dc.contributor.authorPargfrieder, Stefan
dc.date.accessioned2021-10-18T01:39:25Z
dc.date.available2021-10-18T01:39:25Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16009
dc.sourceIIOimport
dc.titleImpact of thinning and packaging on a deep sub-micron CMOS product
dc.typeOral presentation
dc.contributor.imecauthorRuythooren, Wouter
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorSimons, Veerle
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecSimons, Veerle::0000-0001-5714-955X
dc.source.peerreviewno
dc.source.conferenceDesign, Automation & Test in Europe Conference -DATE : Workshop on 3D Integration (W5)
dc.source.conferencedate20/04/2009
dc.source.conferencelocationNice France
imec.availabilityPublished - imec


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