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Cu Plating of Through-Si Vias for 3D-Stacked Integrated Circuits

dc.contributor.authorRadisic, Alex
dc.contributor.authorLuhn, Ole
dc.contributor.authorSwinnen, Bart
dc.contributor.authorBender, Hugo
dc.contributor.authorDrijbooms, Chris
dc.contributor.authorDoumen, Geert
dc.contributor.authorKellens, Kristof
dc.contributor.authorRuythooren, Wouter
dc.contributor.authorVereecken, Philippe
dc.date.accessioned2021-10-18T02:01:46Z
dc.date.available2021-10-18T02:01:46Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16069
dc.sourceIIOimport
dc.titleCu Plating of Through-Si Vias for 3D-Stacked Integrated Circuits
dc.typeProceedings paper
dc.contributor.imecauthorRadisic, Alex
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorDrijbooms, Chris
dc.contributor.imecauthorDoumen, Geert
dc.contributor.imecauthorKellens, Kristof
dc.contributor.imecauthorRuythooren, Wouter
dc.contributor.imecauthorVereecken, Philippe
dc.contributor.orcidimecVereecken, Philippe::0000-0003-4115-0075
dc.source.peerreviewno
dc.source.beginpage1112-E03-06
dc.source.conferenceMaterials and Technologies for 3-D Integration
dc.source.conferencedate1/12/2008
dc.source.conferencelocationBoston, MA USA
dc.identifier.urlhttp://www.mrs.org/s_mrs/sec_subscribe.asp?CID=16750&DID=231997&action=detail
imec.availabilityPublished - imec
imec.internalnotesMRS Proceedings; Vol. 1112


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