Cu Plating of Through-Si Vias for 3D-Stacked Integrated Circuits

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Authors
Radisic, Alex; Luhn, Ole; Swinnen, Bart; Bender, Hugo; Drijbooms, Chris; Doumen, Geert; Kellens, Kristof; Ruythooren, Wouter; Vereecken, Philippe
Conference
Materials and Technologies for 3-D Integration
Title
Cu Plating of Through-Si Vias for 3D-Stacked Integrated Circuits
Publication type
Proceedings paper
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