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Cu Plating of Through-Si Vias for 3D-Stacked Integrated Circuits
Publication:
Cu Plating of Through-Si Vias for 3D-Stacked Integrated Circuits
Date
2009
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Radisic, Alex
;
Luhn, Ole
;
Swinnen, Bart
;
Bender, Hugo
;
Drijbooms, Chris
;
Doumen, Geert
;
Kellens, Kristof
;
Ruythooren, Wouter
;
Vereecken, Philippe
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1960
since deposited on 2021-10-18
Acq. date: 2025-10-24
Citations
Metrics
Views
1960
since deposited on 2021-10-18
Acq. date: 2025-10-24
Citations