dc.contributor.author | Van Olmen, Jan | |
dc.contributor.author | Coenen, Jens | |
dc.contributor.author | Dehaene, Wim | |
dc.contributor.author | De Meyer, Kristin | |
dc.contributor.author | Huyghebaert, Cedric | |
dc.contributor.author | Jourdain, Anne | |
dc.contributor.author | Katti, Guruprasad | |
dc.contributor.author | Mercha, Abdelkarim | |
dc.contributor.author | Rakowski, Michal | |
dc.contributor.author | Stucchi, Michele | |
dc.contributor.author | Travaly, Youssef | |
dc.contributor.author | Beyne, Eric | |
dc.contributor.author | Swinnen, Bart | |
dc.date.accessioned | 2021-10-18T04:18:17Z | |
dc.date.available | 2021-10-18T04:18:17Z | |
dc.date.issued | 2009 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/16407 | |
dc.source | IIOimport | |
dc.title | 3D stacked IC demonstrator using hybrid collective die-to-wafer bonding with copper through silicon vias (TSV) | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Van Olmen, Jan | |
dc.contributor.imecauthor | Dehaene, Wim | |
dc.contributor.imecauthor | De Meyer, Kristin | |
dc.contributor.imecauthor | Huyghebaert, Cedric | |
dc.contributor.imecauthor | Jourdain, Anne | |
dc.contributor.imecauthor | Mercha, Abdelkarim | |
dc.contributor.imecauthor | Rakowski, Michal | |
dc.contributor.imecauthor | Stucchi, Michele | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.imecauthor | Swinnen, Bart | |
dc.contributor.orcidimec | Huyghebaert, Cedric::0000-0001-6043-7130 | |
dc.contributor.orcidimec | Mercha, Abdelkarim::0000-0002-2174-6958 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.source.peerreview | yes | |
dc.source.conference | IEEE 3D-IC | |
dc.source.conferencedate | 28/09/2009 | |
dc.source.conferencelocation | San Francisco, CA USA | |
imec.availability | Published - imec | |